project . 2020 - 2022 . Closed


Novel approach to Area selective Deposition for BEOL Interconnect Applications
Open Access mandate for Publications
European Commission
Funder: European CommissionProject code: 888163 Call for proposal: H2020-MSCA-IF-2019
Funded under: H2020 | MSCA-IF-EF-ST Overall Budget: 178,320 EURFunder Contribution: 178,320 EUR
Status: Closed
01 Sep 2020 (Started) 31 Aug 2022 (Ended)
Open Access mandate
Research data: No

The need for area selective deposition (ASD): Nanoscale patterning of materials is becoming a key issue for a broad range of devices, especially in the back end of line (BEOL). With the introduction of Intel’s latest 10nm node earlier this year, it is vital to develop new ways to master selective deposition of materials at the nanoscale, preferably without the use of lithographic and etching steps, as they can be time-consuming, expensive and mainly subtractive processes. Novel concepts are thus needed to enhance local deposition while decreasing the use of expensive technological steps. Selective deposition is expected to lead to a paradigm shift in patterning at future semiconductor technology nodes. Area Selective Deposition (ASD) by ALD brings several potential benefits for future device processing and provides a route to overcome process integration challenges at the sub 10 nm nodes, i.e. overlay and lithographic misalignment related issues both in the front end of line (FEOL) and back end of line (BEOL) schemes. Essentially, what ASD gives is spatial control over a deposited thin film. This is the objective of the innovative NADIA proposal which is now a very relevant topic.

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